| But how else could it be done? I dont cast the IO pipes with the endtanks because there are material thickness requirements when casting metal. You can't pour metal into a mold to fill a 0.065" thin gap as the metal will solidify before it fills the mold cavity. It is a good bit more expensive to build them with seperate IO pipes and it takes more time to assemble them, but I do it so as not to skimp on the i.d. of the pipe. If they were cast as part of the endtank, the pipe would need to be at least 3/16" thick, reducing the i.d. to ~2.125". The 6061 tube has an i.d. of ~2.37". Blacktwin can attest to this, but once the pipes are welded to the endtanks (before welding to the cores), I spend a good bit of time porting the interface between the pipe and the casting - for both IO pipes on each IC, to smooth out the transistions and try to improve on the airflow as much as possible. .. just a *little* plug... thanks for the question. :)
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